A research team led by Professor Zhiqin Chu from the Department of Electrical and Electronic Engineering and Professor Yuan Lin from the Department of Mechanical Engineering at the University of Hong Kong (HKU), in collaboration with Professor Kwai Hei Li of the Southern University of Science and Technology and Professor Qi Wang of the Dongguan Institute of Opto-Electronics at Peking University, has developed a groundbreaking method for the large-scale production of ultrathin and ultra-flexible diamond membranes.

These diamond membranes are compatible with existing semiconductor manufacturing processes, enabling their integration into a wide range of electronic, photonic, mechanical, acoustic, and quantum devices.

The team’s innovative edge-exposed exfoliation method enables the rapid and scalable production of freestanding diamond membranes. This approach surpasses traditional techniques, which are often time-consuming, expensive, and constrained in size. Notably, the new process can produce a two-inch diamond wafer in just 10 seconds, offering unprecedented efficiency and scalability.

The membranes feature ultra-flat surfaces, critical for high-precision micromanufacturing, and their flexibility paves the way for next-generation flexible and wearable devices in electronics and photonics.

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The research team foresees transformative industrial applications in fields such as electronics, photonics, mechanics, thermal management, acoustics, and quantum technologies.

"We aim to integrate high-performance diamond membranes into various fields, commercialize this breakthrough technology, and set a new standard in the semiconductor industry," said Professor Chu. "Collaborating with academic and industrial partners, we hope to accelerate the diamond era and bring this revolutionary product to market."

Diamonds, celebrated for their exceptional hardness, thermal conductivity, carrier mobility, dielectric breakdown strength, ultrawide bandgap, and optical transparency across a broad spectrum, are already vital in numerous scientific and engineering domains. These properties make diamonds ideal for advanced high-power and high-frequency electronics, photonics, and heat dissipation in devices such as processors, semiconductor lasers, and electric vehicles.

However, the rigid crystal structure and inert nature of diamonds have historically made fabrication and mass production of ultrathin, freestanding membranes highly challenging, limiting their broader adoption. This new method represents a major leap forward, addressing these challenges and unlocking diamonds’ full potential for next-generation technologies.